Swagelok, a solutions provider of fluid system products, assemblies, and related services, has announced the release of a new ultrahigh-purity (UHP) valve for high-flow applications the ALD20. Since introducing atomic layer deposition (ALD) valve technology to the market, Swagelok has worked with semiconductor tool manufacturers and chip fabricators to provide the performance needed to keep pace with quickly changing process requirements. The new ALD20 valve is the latest result of this collaboration, allowing forward-thinking process designers the flexibility to experiment with low-vapor pressure chemistries that may hold the key to tomorrow’s competitive advantage.
The ALD20’s patent-pending design maximizes production process efficiency and deposition consistency by providing flow coefficients two to three times what can be achieved using today’s standard ALD valve technology. It can deliver a flow rate of up to 1.2 Cv in the same footprint (1.5 in.) as existing ALD valves, allowing some users to boost throughput without retooling existing equipment or making additional process changes. The other standard version ALD20 valve with a slightly larger footprint width (1.75 in.) provides an even greater flow rate of up to 1.7 Cv. Custom set flow coefficients are also available.
Designed for peak process consistency, the ALD20 can be fully immersible in a gas box from 50°F (10°C) up to 392ºF (200ºC), enhancing thermal stability and deposition uniformity. It also features a valve body comprised of 316L VIM-VAR stainless steel or Alloy 22 offering enhanced corrosion resistance to withstand aggressive media as well as a highly polished bellows with a 5 μin. Ra finish to support clean operation for long-term process integrity.