Parker Hannifin’s Seal Group announces the release of “Engineered Sealing Solutions for Semiconductor Processing,” a new catalogue featuring Parker sealing components and systems for use in semiconductor fabrication environments. The catalogue, which describes Parker’s complete line of elastomeric, thermoplastic, metal and composite products for critical semiconductor applications, outlines the key features of high performance o-rings, UHP Slit Valve and UHP Gate Valve Doors, end effectors, Thrust Plate Integral Seals, “KF-Type” centering rings, CMP retainer rings and ParFab extruded, spliced and fabricated profiles. It also contains detailed information about the superior thermal stability and broad chemical resistance of Parker’s ultra-pure Parofluor Series Advanced Perfluorinated Elastomers and UltraCOMP Engineered Thermoplastics. In addition, a section titled “Beyond Sealing” highlights Parker’s line of thermally and electrically conductive elastomer pad materials for use in both front and back end semiconductor processing applications.
